20 octubre 2014
Microscopic particles that bind under low temperatures will melt as temperatures rise to moderate levels, but re-connect under hotter conditions, a team of scientists has found. Their discovery points to new ways to create “smart materials,” cutting-edge materials that adapt to their environment by taking new forms, and to sharpen the detail of 3D printing.
http://feeds.sciencedaily.com/~r/sciencedaily/~3/EJTqK_NMN-E/141020104756.htm
