Squeezing out new science from material interfaces

6 marzo 2015

With more than five times the thermal conductivity of copper, diamond is the ultimate heat spreader. By applying extreme pressure in a diamond anvil cell to metal films on diamond, researchers have now determined the physical process dominating this unexplained heat flow, which has implications for understanding and improving heat flow between any two materials.
http://feeds.sciencedaily.com/~r/sciencedaily/~3/42wxLfDlsbo/150306132720.htm

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